Solder Pot Analysis
- The main function of solder pot analysis is to identify and prevent solder pot contamination. Improper pot maintenance can lead to component finishes ending up in the solder pot. Operator error is another common culprit of the contamination.
- Analysis can be designed for the two types of pots involved. Lead-free pots are analyzed for the appropriate balance of metals, while tin/lead solders are examined for the industry-standard tin/lead content.
- Solder pot analysis consists of examining the pot for other unwanted materials, which can include arsenic, gold, iron, copper, silver, zinc, antimony, nickel, sulfur and cadmium.
- Most solder pot analysis companies request a half a pound sample from the solder pot. Regularly scheduled analysis is recommended every 30 days to guarantee effective operation of the pots.